Chip on Board: Technology for Multichip Modules by Lau, John H.

Chip On Board: Technology for Multichip Modules by John H. Lau (English) Hardcov

Flip Chip Technologies by John H. Lau

MICROVIAS: FOR LOW COST, HIGH DENSITY INTERCONNECTS By John H. Lau & S W Ricky

MULTICHIP MODULES SYSTEM ADVANTAGES MAJOR CONSTRUCTION MATERIALS TECHNOLOGIES

Solder Joint Reliability : Theory and Applications by John H. Lau (HC, 1991)

Ball Grid Array Technology by John H. Lau

Chip on Board: Technology for Multichip Modules by John H Lau: New