Publisher Description

This is an excellent text detailing situations the professional will encounter in practice. The book: - Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. - Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk - Outlines how to establish the specifications defining chip performance, cost, quality, and reliability. - Concentrates on device failure and causes throughout the text - showing how to model the mechanism, test for defects, and avoid and manage damange. - Presents information on evolving IC technologies.

Table of Contents

Introduction How Devices Fail Intrinsic Mechanisms Extrinsic Mechanisms Intrinsic Device Sensitivities Device Transconductance Sensitivities Leakage Current Sensitivities Breakdown Issues Electromigration Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage Hot Carrier Aging Description of the Mechanism Modeling of the Mechanism Detection of Hot Carrier Aging Avoidance of Hot Carrier Aging Time Dependent Dielectric Breakdown Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Avoid and Manage Mechanical Stress Induced Migration Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage Alpha Particle Sensitivity Description of the Mechanism Modeling of the Mechanism Prevention of Alpha Particle Induced Damage Electrostatic Discharge and Electrical Overstress Description of the Mechanism Modeling of the Mechanism Avoiding ESD/EOS Failures Latch-Up Description of the Mechanism How to Detect How to Avoid Qualification Qualification Testing Virtual Qualification Screening Functional Tests Burn-In Tests Iddq Tests Design for Reliability Design System Effective Management of Wear-Out Failures Extrinsic Reliability Mechanisms Infant Mortality Failure Mechanisms Circuit Sensitivities Summary

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