Ball Grid Array Technology by John H. Lau

Ball Grid Array Technology

Ball Grid Array Technology - hardcover Lau, John H.

1996 Flip Chip Technologies John H. Lau McGraw-Hill 1st Ed Hardcover LIKE NEW

Advanced Smart Grid : Edge Power Driving Sustainability by John Cooper and...

Chip on Board: Technology for Multichip Modules by John H Lau: Used

Flip Chip Technologies by John H. Lau

MICROVIAS: FOR LOW COST, HIGH DENSITY INTERCONNECTS By John H. Lau & S W Ricky