Flip Chip Technologies

1996 Flip Chip Technologies John H. Lau McGraw-Hill 1st Ed Hardcover LIKE NEW

Flip Chip Technologies by John H. Lau

Digital Equipment Corporation Logic Handbook Flip Chip Modules 1970

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assembli...

AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies,